| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LM100-22B12 | Mornsun金升阳 |
2030 |
30 |
|||||
| TPSE337M010R0060 | 钽电容 |
AVX |
2917 |
2019 |
150 |
|||
| MPL3115A2R | NXP/恩智浦 |
LGA8 |
2026 |
1000 |
||||
| HC32L176KATA-LQ64 | HDSC/华大半导体 |
LQFP-64 |
2126 |
5000 |
||||
| GD32F303RGT6 | GD/兆易创新 |
LQFP-64 |
21+ |
2880 |
||||
| 5CSEBA2U23I7N | IC |
ALTERA/阿尔特拉 |
BGA |
24+ |
960 |
|||
| TMS320C6748EZWTD4 | TI/德州仪器 |
NFBGA-361 |
2023 |
35 |
||||
| LM50-22B12 | Mornsun金升阳 |
2022 |
30 |
|||||
| LM75-20B24 | Mornsun金升阳 |
20+ |
30 |
|||||
| LM50-20B12 | Mornsun金升阳 |
2027 |
30 |
|||||
| LM75-20B12 | Mornsun金升阳 |
2022 |
30 |
|||||
| LM35-20B24 | Mornsun金升阳 |
2027 |
30 |
|||||
| STM8S103K3U6 | ST/意法 |
UFQFPN-32 |
2021 |
200 |
||||
| TLP291-4(GB-TP,E(T | 光电耦合器 |
TOSHIBA/东芝 |
SO-16 |
2021 |
300 |
|||
| HC32F003C4UA-SFN20TR | HDSC/华大半导体 |
QFN-20 |
2132 |
700 |
||||
| CA-IS3050W | 接口IC |
CHIPANALOG/川土微 |
SOIC-16 |
20+ |
1000 |
|||
| CA-IS3082WX | 接口IC |
CHIPANALOG/川土微 |
SOIC-16 |
2123 |
1000 |
|||
| IRFR3607TRPBF | MOS(场效应管) |
INFINEON/英飞凌 |
TO252-2 |
2134 |
8000 |
|||
| ML305-DNLM | Chinamobile中移物联网 |
LCC |
21+ |
2000 |
||||
| LM100-20B12 | Mornsun金升阳 |
2027 |
20 |
商家默认展示20条库存