| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| DRV8432DKDR | 驱动IC |
TI/德州仪器 |
HSSOP-36 |
22+ |
1000 |
|||
| TMS320C6748EZWTD4 | TI/德州仪器 |
NFBGA-361 |
2023 |
35 |
||||
| LM75-22B12 | Mornsun金升阳 |
2027 |
30 |
|||||
| LM50-20B12 | Mornsun金升阳 |
2027 |
30 |
|||||
| LM35-20B24 | Mornsun金升阳 |
2027 |
30 |
|||||
| E-L6219DS013TR | 其他被动元件 |
ST/意法 |
SOIC-24 |
2022 |
500 |
|||
| TC7S00FU,LF | TOSHIBA/东芝 |
SC-70-5 |
1724+ |
1000 |
||||
| IPP084N06L3G | 贴片三极管 |
INFINEON/英飞凌 |
TO220AB |
2144 |
3000 |
|||
| IRS2304STRPBF | 驱动IC |
INFINEON/英飞凌 |
SOIC-8 |
2117 |
5000 |
|||
| IRFS4410ZTRLPBF | 低压MOS管 |
INFINEON/英飞凌 |
TO263-2 |
2133 |
10000 |
|||
| IRFB7446PBF | 低压MOS管 |
INFINEON/英飞凌 |
TO220AB |
2127 |
10000 |
|||
| ML305-DNLM | Chinamobile中移物联网 |
LCC |
21+ |
2000 |
||||
| LM75-20B24 | Mornsun金升阳 |
20+ |
30 |
|||||
| TPSE337M010R0060 | 钽电容 |
AVX |
2917 |
2019 |
150 |
|||
| CA-IS3050W | 接口IC |
CHIPANALOG/川土微 |
SOIC-16 |
20+ |
1000 |
|||
| MPL3115A2R | NXP/恩智浦 |
LGA8 |
2026 |
1000 |
||||
| HC32L196KCTA-LQFP64 | HDSC/华大半导体 |
LQFP-64 |
2116 |
3200 |
||||
| LM100-20B12 | Mornsun金升阳 |
2027 |
20 |
|||||
| LM35-22B12 | Mornsun金升阳 |
2224 |
30 |
|||||
| LM50-22B12 | Mornsun金升阳 |
2022 |
30 |
商家默认展示20条库存