| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TMS320C6748EZWTD4 | TI/德州仪器 |
NFBGA-361 |
2023 |
35 |
||||
| LM100-20B12 | Mornsun金升阳 |
2027 |
20 |
|||||
| LM35-22B12 | Mornsun金升阳 |
2224 |
30 |
|||||
| LM75-20B12 | Mornsun金升阳 |
2022 |
30 |
|||||
| SGM721XN5/TR | SGMICRO/圣邦微 |
SOT23-5 |
2051 |
900 |
||||
| TLP290(GR-TP,SE | 光电耦合器 |
TOSHIBA/东芝 |
SOIC-4 |
2205 |
5000 |
|||
| CA-IS3050W | 接口IC |
CHIPANALOG/川土微 |
SOIC-16 |
20+ |
1000 |
|||
| CA-IS3082WX | 接口IC |
CHIPANALOG/川土微 |
SOIC-16 |
2123 |
1000 |
|||
| TPS65300QRHFRQ1 | 运放IC |
TI/德州仪器 |
VQFN-24 |
2104 |
2000 |
|||
| CY8C4146AZI-S423T | 贴片电容 |
CYPRESS/赛普拉斯 |
TQFP-48 |
2130 |
11000 |
|||
| IRFP7537PBF | N沟道MOS管 |
INFINEON/英飞凌 |
TO247-3 |
1830 |
15000 |
|||
| ML305-DNLM | Chinamobile中移物联网 |
LCC |
21+ |
2000 |
||||
| LM100-22B12 | Mornsun金升阳 |
2030 |
30 |
|||||
| LM50-20B12 | Mornsun金升阳 |
2027 |
30 |
|||||
| LM35-20B24 | Mornsun金升阳 |
2027 |
30 |
|||||
| TPSE337M010R0060 | 钽电容 |
AVX |
2917 |
2019 |
150 |
|||
| HC32F003C4UA-SFN20TR | HDSC/华大半导体 |
QFN-20 |
2132 |
700 |
||||
| STM32F303RCT6TR | 32位MCU |
ST/意法 |
LQFP-64 |
1912 |
960 |
|||
| HC32L196MCTA-LQFP80 | HDSC/华大半导体 |
LQFP-80 |
2112 |
600 |
||||
| MX35LF1GE4AB-Z4I | Mxic旺宏 |
WSON-8 |
2136 |
4800 |
商家默认展示20条库存